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| 2830 S. Fairview St. Santa Ana, CA 92704 PH: (714) 979-8220 FAX: (714) 966-5256 MSAEZ33N20A MSAFZ33N20A 200 Volts 33 Amps 70 m N-CHANNEL ENHANCEMENT MODE POWER MOSFET Features * * * * * * * Ultrafast rectifier in parallel with the body diode (MSAE type only) Rugged polysilicon gate cell structure Increased Unclamped Inductive Switching (UIS) capability Hermetically sealed, surface mount power package Low package inductance Very low thermal resistance Reverse polarity available upon request Maximum Ratings @ 25C (unless otherwise specified) DESCRIPTION Drain-to-Source Breakdown Voltage (Gate Shorted to Source) @ TJ 25C SYMBOL BVDSS BVDGR VGS VGSM ID25 ID100 IDM IAR EAR EAS dv/dt PD Tj Tstg IS ISM JC MAX. 200 200 +/-20 +/-30 33 20 132 33 16 790 TBD 300 -55 to +150 -55 to +150 33 132 0.4 UNIT Volts Volts Volts Volts Amps Amps Amps mJ mJ V/ns Watts C C Amps Amps C/W Drain-to-Gate Breakdown Voltage @ TJ 25C, RGS= 1 M Continuous Gate-to-Source Voltage Transient Gate-to-Source Voltage Continuous Drain Current 100C Tj= 25C Tj= Peak Drain Current, pulse width limited by TJmax Repetitive Avalanche Current Repetitive Avalanche Energy Single Pulse Avalanche Energy Voltage Rate of Change of the Recovery Diode @ IS IDM, di/dt 100 A/s, VDD VDSS, TJ 150C Power Dissipation Junction Temperature Range Storage Temperature Range Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Thermal Resistance, Junction to Case Mechanical Outline DRAIN GATE SOURCE Datasheet# MSC0300A MSAEZ33N20A MSAFZ33N20A Electrical Parameters @ 25C (unless otherwise specified) DESCRIPTION Drain-to-Source Breakdown Voltage (Gate Shorted to Source) Temperature Coefficient of the Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Current Drain-to-Source Leakage Current (Zero Gate Voltage Drain Current) Static Drain-to-Source On-State Resistance (1) SYMBOL BVDSS BVDSS/TJ VGS(th) IGSS IDSS RDS(on) CONDITIONS VGS = 0 V, I D = 250 A MIN 200 TYP. TBD MAX UNIT V V/C Forward Transconductance (1) Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate-to-Source Charge Gate-to-Drain (Miller) Charge Body Diode Forward Voltage (1) Reverse Recovery Time (Body Diode) Reverse Recovery Charge gfs Ciss Coss Crss Td(on) tr td(off) tf Qg(on) Qgs Qgd VSD trr Qrr VDS = VGS, ID = 1 mA VGS = 20V DC, VDS = 0 T J = 25C T J = 125C VDS =0.8*BVDSS TJ = 25C VGS = 0 V T J = 125C VGS= 10V, I D= 21A T J = 25C I D= 33A T J = 25C I D= 21A T J = 125C VDS 15 V; I D = 21 A VGS = 0 V, V DS = 25 V, f = 1 MHz 2.0 3.0 15 0.06 TBD 0.11 23 2600 500 230 40 110 450 160 120 10 70 1.3 4.0 100 200 25 250 0.07 V nA A S 3900 750 350 60 170 680 240 pF VGS = 10 V, V DS = 30 V, ID = 3 A, R G = 50 ns VGS = 10 V, V DS = 160V, I D = 50A nC IF = IS, VGS = 0 V IF = 10 A, -di/dt = 100 A/ s, IF = 10 A, di/dt = 100 A/ s, MSAE MSAF MSAE MSAF MSAE MSAF 1.2 1.6 50 230 tbd 1.8 V ns C Notes (1) (2) Pulse test, t 300 s, duty cycle 2% Microsemi Corp. does not manufacture the mosfet die; contact company for details. |
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